BP-500 solder paste vision printer and SMT line equipment

A standard printer platform, a custom high-throughput model built around your line, and the handling equipment that connects them.

BP-500 solder paste printer
Print stage with the board clamped under the stencil
Print stage

In development · Pilot build Q4 2026

BP-500 Standard

A standard printer platform for multi-product SMT lines, with camera-vision alignment and closed-loop squeegee pressure control. Designed and built by BPK in Daegu, Korea.

Target specifications
PCB size50 × 50 mm to 460 × 510 mm
AlignmentCamera vision, ±12.5 µm (target)
Cycle time6–8 s (target)
SqueegeeClosed-loop pressure control
Paste supplyAutomatic dispenser
Stencil cleaningDry, wet and vacuum
AI visionOption — under development
Line interfaceSMEMA standard

Development targets. Final values are confirmed in factory and site acceptance tests before delivery.

Custom high-throughput printer

Built to customer specification

Custom High-Throughput model

For large boards, high-volume lines and special substrates. We design the machine around your technical specification sheet and your line layout.

  • Boards of 750 mm and larger
  • Dual squeegee option
  • Advanced camera vision
  • AI vision with SPI feedback (under development)
  • Line interface to your specification

Handling equipment that completes the line

All units use the SMEMA interface, so they work with printers, mounters and reflow ovens from other makers.

Magazine loader and unloader
Loader and unloader
PCB conveyor
Conveyor
  • LoaderFeeds bare boards from magazines onto the line.
  • UnloaderCollects finished boards into magazines at the end of the line.
  • ConveyorTransfers boards between stations.
  • BufferHolds boards between stations to absorb differences in cycle time.
  • Line interfaceConnects BPK and third-party machines over SMEMA signals.

Tell us about your boards and line

Board size range, volumes and the machines already on your line help us answer precisely.

Send an inquiry